Switzerland-based Ismeca Semiconductor is proud to announce that the European Patent Office has granted under N° EP1602266 Ismeca’s patent application EP1602266 for a "Method and Device for the Extraction of Electronic Components from Tubes". This patent covers the method and device used in many Ismeca systems for extracting ICs from transport tubes whether they are closed with a cover or open.
Corresponding patent applications have already been granted, or are expected to be issued, in various countries outside Europe, including the US, China, Hong Kong, Malaysia and Singapore.
Other features of the feeder, notably the innovative vibration - or air-based dejamming system, are also protected in several of these countries. A patent has notably been granted in Singapore for a method and device for conditioning electronic components into tubes and an electronic component outputting device.
The optical device and inspection module used in Ismeca’s machines has recently been awarded a patent in the USA under US20050185181 and offers broad coverage for optical systems allowing the simultaneous inspection of five sides of the components.
These European and US patents are significant to the company, as the European, USA and Asia-Pacific regions are crucial parts of Ismeca’s global business strategy.
These patent families add to Ismeca Semiconductor impressive intellectual property portfolio for IC feeding, test systems, and 5-sides optical vision systems. Ismeca Semiconductor believes that a few competitors clearly infringe at least several of their key patents, including the above mentioned feeder and optical device patents, and is determined to take any necessary step for defending its rights, including requesting injunctions against infringers – i.e. anyone who manufactures, imports, sells or offers for sale the patented machines or uses any such machines that infringe these rights.
