SEARCH
 

 
NX32W-KGD configuration Bare Die
 
NX32W-KGD configuration Bumped Die
 
NX32W-KGD description
 
 

YOUR LOCAL CONTACT

4:56 PM | 09-06-2010

Ismeca Semiconductor SA
283, rue de l'Helvétie
2301 La Chaux-de-Fonds
Switzerland

Tel.: +41 (0)32 925 71 11
Fax: +41 (0)32 925 75 45
sales-eu@ismeca.com
 

products » wlp » nx32w-kgd

NX32W-KGD configuration Bumped Die
Typical configuration for
wafer to tape handler dedicated to bumped dies
    
 
 
  developed by Grafikstudio.ch (c) Ismeca Europe Semiconductor SA | Sitemap | Legal | Last updated: 2010-09-06