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Throughput to 15'000 parts per hour
- High speed die handler for Known Good Die testing and taping
- Wafer frame input: 4 to 12" (metal or plastic)
- Standard cassette type (24 x 8" - 13 x 12")
- Applications: Bumped Die
Bare Die Power
Leadless packages (from 1.0 x 0.5 to 12 x 12 mm)
- Kelvin test capability on single bumped dies
- Top and bottom contacting for Bare Die Power
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